Detailed Course Information |
Fall 2024
Sep 19, 2024 |
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| ECE 6776 - Microelec Sys Packaging |
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Introduction to cross-disciplinary microelectronic packaging technologies, including electrical design, thermal considerations and technologies, reliability, optoelectronic packaging, and RF-/mm-packaging. Crosslisted with ME and MSE 6776.
3.000 Credit hours 3.000 Lecture hours Grade Basis: ALP All Sections for this Course Sch/Electrical & Computer Engr Department Restrictions: May not be enrolled in one of the following Levels: Undergraduate Semester Must be enrolled in one of the following Campuses: Georgia Tech-Atlanta * |
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