Detailed Course Information |
Fall 2024
Nov 12, 2024 |
|
 |
||
 | Click the Schedule Type to find available offerings of the course on the Schedule of Classes. |
| ME 6776 - Microelec Sys Packaging |
|
Broad overview of system-level, cross-disciplinary microelectronics packaging technologies, including design, test, thermal, reliability, optoelectronics, and RF integration. Comparison of system-on-chip and system-on-package. Crosslisted with ECE and MSE 6776.
3.000 Credit hours 3.000 Lecture hours Grade Basis: ALP Sch/Mechanical Engineering Department Restrictions: May not be enrolled in one of the following Levels: Undergraduate Semester Must be enrolled in one of the following Campuses: Georgia Tech-Atlanta * |
| Return to Previous | New Search |
|