Detailed Course Information |
Fall 2024
Jan 18, 2025 |
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 | Click the Schedule Type to find available offerings of the course on the Schedule of Classes. |
| MSE 6776 - Microelec Sys Packaging |
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Broad overview of system-level, cross-disciplinary microelectronics packaging technologies, including design, test, thermal, reliability, optoelectronics, and RF integration. Comparison of system-to-chip and system-to-package. Crosslisted with ECE and ME 6776.
3.000 Credit hours 3.000 Lecture hours Grade Basis: ALP Sch/Materials Science & Engr Department Restrictions: May not be enrolled in one of the following Levels: Undergraduate Semester Must be enrolled in one of the following Campuses: Georgia Tech-Atlanta * |
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