The pre-requisites listed in this catalog are those approved by the Curriculum Committee.
For pre-requisite information specific to an individual instance of a course, please see the schedule of classes. Click the Schedule Type to find available offerings of the course on the Schedule of Classes. |
MSE 4755 - Electronic Packaging Substrate Fabrication |
This course provides students with hands-on instruction in basic SOP concepts and techniques, including interconnect design, substrate material selection and properties, photodielectric deposition, via formation and photolithography, copper metallization, and finally, substrate testing. Laboratory instructions are augmented by an interactive multimedia educational presentation that makes the course work material remotely accessible via the internet.
0.000 OR 3.000 Credit hours 0.000 OR 1.000 Lecture hours 0.000 OR 6.000 Lab hours Grade Basis: ALP All Sections for this Course Sch/Materials Science & Engr Department Course Attributes: Tech Elect CS, Engr, &Sciences |