Detailed Course Information |
Fall 2023
Nov 21, 2024 |
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| MSE 4755 - Electronic Packaging Substrate Fabrication |
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This course provides students with hands-on instruction in basic SOP concepts and techniques, including interconnect design, substrate material selection and properties, photodielectric deposition, via formation and photolithography, copper metallization, and finally, substrate testing. Laboratory instructions are augmented by an interactive multimedia educational presentation that makes the course work material remotely accessible via the internet.
0.000 OR 3.000 Credit hours 0.000 OR 1.000 Lecture hours 0.000 OR 6.000 Lab hours Grade Basis: ALP All Sections for this Course Sch/Materials Science & Engr Department Course Attributes: Tech Elect CS, Engr, &Sciences Restrictions: Must be enrolled in one of the following Campuses: Georgia Tech-Atlanta * Prerequisites: (Undergraduate Semester level MATH 2401 Minimum Grade of D or Undergraduate Semester level MATH 2411 Minimum Grade of D or Undergraduate Semester level MATH 24X1 Minimum Grade of T or Undergraduate Semester level MATH 2551 Minimum Grade of D or Undergraduate Semester level MATH 2X51 Minimum Grade of T or Undergraduate Semester level MATH 2561 Minimum Grade of D) and (Undergraduate Semester level MATH 2403 Minimum Grade of D or Undergraduate Semester level MATH 2413 Minimum Grade of D or Undergraduate Semester level MATH 24X3 Minimum Grade of T or Undergraduate Semester level MATH 2552 Minimum Grade of D or Undergraduate Semester level MATH 2X52 Minimum Grade of T or Undergraduate Semester level MATH 2562 Minimum Grade of D) and Undergraduate Semester level CHEM 1211K Minimum Grade of D and Undergraduate Semester level PHYS 2212 Minimum Grade of D |
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