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|ECE 4755 - Electronic Packaging Substrate Fabrication
This course provides hands-on instruction in basic packaging substrate fabrication techniques, including interconnect design and testing, dielectric deposition, via formation, and metallization. Crosslisted with CHE 4755.
0.000 OR 3.000 Credit hours
0.000 OR 1.000 Lecture hours
0.000 OR 6.000 Lab hours
Grade Basis: ALP
All Sections for this Course
Sch/Electrical & Computer Engr Department
Tech Elect CS, Engr, &Sciences
Must be enrolled in one of the following Campuses:
Georgia Tech-Atlanta *
(Undergraduate Semester level CHEM 1310 Minimum Grade of D or Undergraduate Semester level CHEM 1211K Minimum Grade of D or Undergraduate Semester level CHEM 12X1 Minimum Grade of C) and Undergraduate Semester level PHYS 2212 Minimum Grade of D
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